Codex International proposes a thermal oxidation service for Si wafers by dry or wet process allowing the growth of a dense and uniform oxide layer of high dielectric strength and thickness from a few nanometers to 50 microns.
Compliance certificates
All our materials are analyzed before delivery by Inductively Coupled Plasma spectrometry and are accompanied by their c [...]
Target Bonding
Codex International offers an Indium, Elastomer or Nanofoil bonding service according to your wishes or technical constr [...]
Wafer dicing
Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing f [...]
