Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing for wafers diameters from 50 mm to 300 mm can be cut to your dimensions (examples: 5 x 5mm, 10x10mm, 10x5mm ...).
Thermal Oxydation
Codex International proposes a thermal oxidation service for Si wafers by dry or wet process allowing the growth of a de [...]
![Targer recycling - [Codex International]](https://codex-international.com/wp-content/uploads/2018/10/6e110feeface5dc0c386188860a44f0a-200x130.jpg)
Targets recycling
Our precious metals recycling/refining service is efficient, transparent and environmentally friendly. The ISO 9001 cer [...]
Wafer dicing
Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing f [...]
