Codex International proposes a thermal oxidation service for Si wafers by dry or wet process allowing the growth of a dense and uniform oxide layer of high dielectric strength and thickness from a few nanometers to 50 microns.
Wafer dicing
Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing f [...]
Thermal Oxydation
Codex International proposes a thermal oxidation service for Si wafers by dry or wet process allowing the growth of a de [...]
Nitriding
Our LPCVD wafer Si3N4 Nitruration service allows, among other things, to obtain high chemical resistance to acids, salts [...]
