Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing for wafers diameters from 50 mm to 300 mm can be cut to your dimensions (examples: 5 x 5mm, 10x10mm, 10x5mm ...).
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Targets recycling
Our precious metals recycling/refining service is efficient, transparent and environmentally friendly. The ISO 9001 cer [...]
On request deposition
Codex International offers its customers the ability to metallize their Si wafers (single or multilayers). A range of me [...]
Wafer dicing
Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing f [...]
