Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing for wafers diameters from 50 mm to 300 mm can be cut to your dimensions (examples: 5 x 5mm, 10x10mm, 10x5mm ...).
Target Bonding
Codex International offers an Indium, Elastomer or Nanofoil bonding service according to your wishes or technical constr [...]
On request deposition
Codex International offers its customers the ability to metallize their Si wafers (single or multilayers). A range of me [...]
Wafer dicing
Several Dicing techniques are available to adapt to your needs and dimensions of dice: dicing by diamond, laser dicing f [...]
