22 June 2021

[Thin-Film Innovation] – EPC© sputtering targets manufacturing process

Home > News > [Thin-Film Innovation] – EPC© sputtering targets manufacturing process
Flèche contenu

Product innovation
Codex International’s new EPC © (Enhanced Process Control) process is an innovative manufacturing process that improves target performance, durability and deposit homogeneity.
Codex International has developed a new technology for manufacturing EPC© sputtering targets that optimizes the flow of materials and significantly improves their sputtering performance.
Our EPC© process allows a better control of crystalline orientations and grain size (especially for ferromagnetic materials). Sputtering targets manufactured using Codex International’s EPC© process have the following competitive advantages
– Minimize magnetic shunting
– Stabilize the plasma
– Improve thin film uniformity
– Increase thin film deposition rates and reduce cycle times.

 

Discover Also
[Thin films] – Catalyst deposition on fragile chips 22 February 2020

Researchers at the Ruhr-Universität Bochum (RUB) and the University of Duisburg-Essen have developed a new method of depositing catalyst particles to tiny electrodes. It is inexpensive, simple and quick to perform.

Read more
[Materials] – Electronic nose prototype uses nanoengineered materials. 5 October 2021

There’s nothing like the smell of freshly brewed coffee in the morning. But how does one measure that smell? There’s no energy in a smell to help estimate how potent the coffee might be …

Read more