January 21, 2025

[Nano-Technology]-New Chainmail-Like 2d Material Could Be the Future of Armor.

Home / News / [Nano-Technology]-New Chainmail-Like 2D Material Could Be the Future of Armor.
Content arrow
New Chainmail Codex International

In a remark feat of chemistry, a Northwestern University-Led Research Team has developed the first two-dimensional (2D) Mechanically Interlocked Material.
Resembling the Interlocking Links in Chainmail, The Nanoscale Material Exceptional Exception Flexibility and Strength. With Further Work, It Holds Promise for Use in High-Performance, Light-Weight Body Armor and Other Uses That Demand Lightweight, Flexible and Tough Materials.
Publishing in the Journal Science ("Mechanically Interlocked Two-Dimensal Polymers"), The Study Marks Several First for the Field. Not only is the first 2d mechanalely interlocked polymer, but the novel material also contains 100 trillion mechanical bonds per 1 square centimeter - the highhest density of mechanical bonds Ever Achieved. The Researchers produced this Material Using A New, Highly Efficient and Scalable Polymerization Process.
In a remark feat of chemistry, a Northwestern University-Led Research Team has developed the first two-dimensional (2D) Mechanically Interlocked Material.
Resembling the Interlocking Links in Chainmail, The Nanoscale Material Exceptional Exception Flexibility and Strength. With Further Work, It Holds Promise for Use in High-Performance, Light-Weight Body Armor and Other Uses That Demand Lightweight, Flexible and Tough Materials.
Publishing in the Journal Science ("Mechanically Interlocked Two-Dimensal Polymers"), The Study Marks Several First for the Field. Not only is the first 2d mechanalely interlocked polymer, but the novel material also contains 100 trillion mechanical bonds per 1 square centimeter - the highhest density of mechanical bonds Ever Achieved. The Researchers produced this Material Using A New, Highly Efficient and Scalable Polymerization Process.

Discover
[Innovation] - Codex International Fully Committed to "Lead Free Materials" September 4, 2023 Read more
[E-beam]-e-beam atomic-scale 3D 'sculpting' could enable new quantum nanodevices September 15, 2020 Read more