Codex International’s new EPC © (Enhanced Process Control) process is an innovative manufacturing process that improves target performance, durability and deposit homogeneity.
Codex International has developed a new technology for manufacturing EPC© sputtering targets that optimizes the flow of materials and significantly improves their sputtering performance.
Our EPC© process allows a better control of crystalline orientations and grain size (especially for ferromagnetic materials). Sputtering targets manufactured using Codex International’s EPC© process have the following competitive advantages
– Minimize magnetic shunting
– Stabilize the plasma
– Improve thin film uniformity
– Increase thin film deposition rates and reduce cycle times.
‘Growing’ electronic components directly onto a semiconductor block avoids messy, noisy oxidation scattering that slows and impedes electronic operation.Read more
Transition metal dichalcogenides (TMDs) represent a large family of layered semiconductor materials of the type MX2, with M a transition metal atom (Mo, W, etc.) and X a chalcogen atom (S, Se, or Te). One layer of M atoms is sandwiched between two layers of X atoms. Many TMDs exhibit tunable band gaps that can undergo a transition from …Read more