• FinTech
  • Forex Trading
  • Sober living

21 janvier 2025

[Nano-technology] – New chainmail-like 2D material could be the future of armor.

Accueil > Actualités > [Nano-technology] – New chainmail-like 2D material could be the future of armor.
Flèche contenu
New chainmail Codex international

In a remarkable feat of chemistry, a Northwestern University-led research team has developed the first two-dimensional (2D) mechanically interlocked material.
Resembling the interlocking links in chainmail, the nanoscale material exhibits exceptional flexibility and strength. With further work, it holds promise for use in high-performance, light-weight body armor and other uses that demand lightweight, flexible and tough materials.
Publishing in the journal Science (« Mechanically interlocked two-dimensional polymers »), the study marks several firsts for the field. Not only is it the first 2D mechanically interlocked polymer, but the novel material also contains 100 trillion mechanical bonds per 1 square centimeter — the highest density of mechanical bonds ever achieved. The researchers produced this material using a new, highly efficient and scalable polymerization process.
In a remarkable feat of chemistry, a Northwestern University-led research team has developed the first two-dimensional (2D) mechanically interlocked material.
Resembling the interlocking links in chainmail, the nanoscale material exhibits exceptional flexibility and strength. With further work, it holds promise for use in high-performance, light-weight body armor and other uses that demand lightweight, flexible and tough materials.
Publishing in the journal Science (« Mechanically interlocked two-dimensional polymers »), the study marks several firsts for the field. Not only is it the first 2D mechanically interlocked polymer, but the novel material also contains 100 trillion mechanical bonds per 1 square centimeter — the highest density of mechanical bonds ever achieved. The researchers produced this material using a new, highly efficient and scalable polymerization process.

Découvrir
[Thin-Film] – Feasibility of thin-film electronics for flexible chip design 17 juin 2024 Lire la suite
[Innovation] – Codex International now offers the very last SPS sintering technology. 4 septembre 2023 Lire la suite